A high speed, high performance integrated circuit packaging structure that may be used for emulating wafer scale integration structures. The preferred embodiment comprises an interposer having a base substrate having alternating insulation and conductive layers thereon, wherein a plurality of the conductive...http://www.google.fr/patents/US4811082?utm_source=gb-gplus-shareBrevet US4811082 - High performance integrated circuit packaging structure
High performance integrated circuit packaging structure
