A process of forming bumps on respective electrodes of a semiconductor chip comprises the steps of a) preparing a bonding apparatus equipped with a bonding tool three-dimensionally movable, b) forming a small ball at the leading end of a wire passing through the bonding tool, c) causing the bonding tool...http://www.google.fr/patents/US5060843?utm_source=gb-gplus-shareBrevet US5060843 - Process of forming bump on electrode of semiconductor chip and apparatus used therefor
Process of forming bump on electrode of semiconductor chip and apparatus ...
