A MCP semiconductor device includes at least first and second chips, each of which has internal pads and an internal circuit, encapsulated by a sealing material together. The device further includes a test circuit. The test circuit connects each of the internal pads to one of the internal circuits under...http://www.google.fr/patents/US6762486?utm_source=gb-gplus-shareBrevet US6762486 - Test circuit and multi-chip package type semiconductor device having the test circuit
Test circuit and multi-chip package type semiconductor device having the ...
