A semiconductor device includes a semiconductor substrate having a plurality of connecting pads on one surface, an insulating film formed on one surface of the semiconductor substrate. The insulating film has holes each corresponding to one of the connecting pads, and a recess having a bottom surface...http://www.google.fr/patents/US7285867?utm_source=gb-gplus-shareBrevet US7285867 - Wiring structure on semiconductor substrate and method of fabricating the same
Wiring structure on semiconductor substrate and method of fabricating the same
