An adhesive composition for use in the mounting of electronic parts on a printed circuit board is disclosed. The composition comprises a photosetting and thermosetting resin ingredient and a long-chain saturated fatty acid amide. Also disclosed is a method for mounting electronic parts on a printed circuit...http://www.google.fr/patents/US5427642?utm_source=gb-gplus-shareBrevet US5427642 - Method for mounting electronic parts on a printed circuit board by use of an adhesive composition
Method for mounting electronic parts on a printed circuit board by use of an ...
