The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into contact with terminals for electric...http://www.google.fr/patents/US7511519?utm_source=gb-gplus-shareBrevet US7511519 - Electric signal connecting device and probe assembly and probing device using the same
Electric signal connecting device and probe assembly and probing device ...
