A semiconductor device including a multilevel wiring with a small interwiring capacitance is provided by comprising a wiring, a conductive film formed on an upper surface of the wiring to prevent diffusion of a wiring material, and an insulating film which is constituted of low dielectric constant insulating...http://www.google.fr/patents/US7470609?utm_source=gb-gplus-shareBrevet US7470609 - Semiconductor device and method for manufacturing the same
Semiconductor device and method for manufacturing the same
