Devices, systems and methods for monitoring characteristics of semiconductor substrates and workpieces during planarization and for endpointing planarization processes are provided. The invention utilizes a fiber optic contact sensor incorporated into a planarizing pad or pad-subpad assembly for process...http://www.google.fr/patents/US7537511?utm_source=gb-gplus-shareBrevet US7537511 - Embedded fiber acoustic sensor for CMP process endpoint
Embedded fiber acoustic sensor for CMP process endpoint
