According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective...http://www.google.fr/patents/US7902083?utm_source=gb-gplus-shareBrevet US7902083 - Passivation layer for a circuit device and method of manufacture
Passivation layer for a circuit device and method of manufacture
