A package for an integrated circuit includes a circuit board 122 for mounting the integrated circuit 114 having a first surface and a second surface, a connection device positioned on the first surface of the circuit board 122 for electrically connecting the integrated circuit 114 and the integrated...http://www.google.fr/patents/US6667560?utm_source=gb-gplus-shareBrevet US6667560 - Board on chip ball grid array
