A plating apparatus, anode assembly, and method therefor are disclosed herein that improves the uniformity of the plating deposition across the surface of a wafer, substrate or article. This improvement is accomplished by compensating for the uneven plating deposition caused by a seed layer disposed...http://www.google.fr/patents/US6251238?utm_source=gb-gplus-shareBrevet US6251238 - Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance
Anode having separately excitable sections to compensate for non-uniform ...
