The invention relates to a process of forming a thermal interface that employs carbon nanotubes to reduce thermal resistance between an electronic device and a cooling solution. Bundles of aligned nanotubes receive injected polymeric material to produce a polymeric/carbon composite which is then placed...http://www.google.fr/patents/US20030117770?utm_source=gb-gplus-shareBrevet US20030117770 - Carbon nanotube thermal interface structures
Numéro de demande: 10/027,442 Numéro de publication: US 2003/0117770 A1 Date de dépôt: 20 déc. 2001 Brevet délivré: US6965513 ( Date de délivrance 15 nov. 2005)
