A package for semiconductor light emitting element is described. The package includes a first metal substrate having a cup shaped recess portion, an insulating member having a first cup shaped opening, provided on the first metal substrate, and a second metal substrate having a second cup shaped opening,...http://www.google.fr/patents/US20050280019?utm_source=gb-gplus-shareBrevet US20050280019 - Package for semiconductor light emitting element and semiconductor light emitting device
Package for semiconductor light emitting element and semiconductor light ...
Numéro de demande: 11/158,326 Numéro de publication: US 2005/0280019 A1 Date de dépôt: 22 juin 2005 Brevet délivré: US7332802 ( Date de délivrance 19 févr. 2008)
