A method of manufacturing a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, and providing a support circuit that includes an insulative base, a conductive trace and a through-hole that extends through the conductive trace and is covered by the base....http://www.google.fr/patents/US6551861?utm_source=gb-gplus-shareBrevet US6551861 - Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive
Method of making a semiconductor chip assembly by joining the chip to a ...
