The present invention pertains to apparatus and methods for electroplanarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by use of a flexible planar cathode and a spacing pad thereon. Methods of the invention are...http://www.google.fr/patents/US6756307?utm_source=gb-gplus-shareBrevet US6756307 - Apparatus for electrically planarizing semiconductor wafers
Apparatus for electrically planarizing semiconductor wafers
