An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the...http://www.google.fr/patents/US8115305?utm_source=gb-gplus-shareBrevet US8115305 - Integrated circuit package system with thin profile
Integrated circuit package system with thin profile
