While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet, corresponding to an adhesion region of a semiconductor chip, is sucked and held, a plurality of protruding portions of a removing member are brought into contact with the bottom surface of the semiconductor chip...http://www.google.fr/patents/US7637714?utm_source=gb-gplus-shareBrevet US7637714 - Apparatus and method for removing semiconductor chip
Apparatus and method for removing semiconductor chip
