This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion...http://www.google.fr/patents/US6632292?utm_source=gb-gplus-shareBrevet US6632292 - Selective treatment of microelectronic workpiece surfaces
Selective treatment of microelectronic workpiece surfaces
