A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred...http://www.google.fr/patents/US5656548?utm_source=gb-gplus-shareBrevet US5656548 - Method for forming three dimensional processor using transferred thin film circuits
Method for forming three dimensional processor using transferred thin film ...
