A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an encapsulation material and a plurality of conductive balls. The semiconductor chip has a first surface and a second...http://www.google.fr/patents/US6830955?utm_source=gb-gplus-shareBrevet US6830955 - Semiconductor package and method for manufacturing the same
Semiconductor package and method for manufacturing the same
