A fabrication method and resultant three-dimensional multichip package having a densely stacked array of semiconductor chips interconnected at least partially by means of a plurality of metallized trenches are disclosed. The fabrication method includes providing an integrated circuit chip having high...http://www.google.fr/patents/US5202754?utm_source=gb-gplus-shareBrevet US5202754 - Three-dimensional multichip packages and methods of fabrication
Three-dimensional multichip packages and methods of fabrication
