Active compound chip and process for the production of an active compound chip comprising an active compound which is bound at room temperature, at least one heating element being located at least partly in the interior of the chip and the heating element having an electrical resistance and at least...http://www.google.fr/patents/US20030049025?utm_source=gb-gplus-shareBrevet US20030049025 - Chip that comprises an active agent and an integrated heating element
Chip that comprises an active agent and an integrated heating element
Numéro de demande: 10/181,087 Numéro de publication: US 2003/0049025 A1 Date de dépôt: 12 juil. 2002 Brevet délivré: US7215878 ( Date de délivrance 8 mai 2007)
