A multilayer interconnected electronic component having increased electromigration lifetime is provided. The interconnections are in the form of studs and comprise vertical side walls having a refractory metal diffusion barrier liner along the sidewalls. The stud does not have a barrier layer at the...http://www.google.fr/patents/US6300236?utm_source=gb-gplus-shareBrevet US6300236 - Copper stud structure with refractory metal liner
