A flexible resin substrate with a device hole at the center thereof is formed wiring leads with copper foil on the back side face. A tape carrier having such construction forms substrate of a package. The wiring leads are formed to extend from the back side face of the flexible resin substrate...http://www.google.fr/patents/US5729051?utm_source=gb-gplus-shareBrevet US5729051 - Tape automated bonding type semiconductor device
