A method of fabricating a substrate module is provided that includes cavities of a diameter and depth which take into account the statistical variance in the dimensions of C4 solder balls. By constructing cavities with the proper dimensions, electrical connection between the chip and substrate, via the...http://www.google.fr/patents/US5279711?utm_source=gb-gplus-shareBrevet US5279711 - Chip attach and sealing method
