The invention provides a bump structure whose mounting position, shape, and size are favorably controlled and to a method of manufacturing the same. The bump structure of the invention can be provided on an insulating layer and includes a protruding part made of resin obtained by hardening a liquid material...http://www.google.fr/patents/US7402508?utm_source=gb-gplus-shareBrevet US7402508 - Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
Bump structure and method of manufacturing the same, and mounting structure ...
