A method for fabricating a semiconductor component includes the steps of providing a substrate having a contact on a circuit side thereof, forming an opening from a backside of the substrate to the contact, forming a conductive via in the opening in electrical contact with a surface of the contact, and...http://www.google.fr/patents/US7459393?utm_source=gb-gplus-shareBrevet US7459393 - Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
Method for fabricating semiconductor components with thinned substrate ...
