An interconnect for establishing temporary electrical communication with semiconductor dice, or packages, having contact bumps is provided. The interconnect includes patterns of contact members adapted to receive the contact bumps. Each contact member includes a recess covered with a conductive layer...http://www.google.fr/patents/US6232243?utm_source=gb-gplus-shareBrevet US6232243 - Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps
Interconnect having recessed contact members with penetrating blades for ...
