A method of forming a planarized dielectric layer includes depositing a dielectric material on a substrate with a dopant concentration that decreases with depth and then chemically mechanically polishing the doped dielectric material. During the chemical mechanical polishing process the polish rate will...http://www.google.fr/patents/US5449314?utm_source=gb-gplus-shareBrevet US5449314 - Method of chimical mechanical polishing for dielectric layers
Method of chimical mechanical polishing for dielectric layers
