Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodiment, the flexible circuit provides...http://www.google.fr/patents/US7309914?utm_source=gb-gplus-shareBrevet US7309914 - Inverted CSP stacking system and method
