A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it...http://www.google.fr/patents/US6388458?utm_source=gb-gplus-shareBrevet US6388458 - Spring element for use in an apparatus for attaching to a semiconductor and a method of making
Spring element for use in an apparatus for attaching to a semiconductor and ...
