A method of integrating a topside optical device, having electrical contacts on a top side, with an electronic chip having electrical contacts on a connection side, involves creating a trench, defined by a wall, from the top side of a wafer containing the topside optical device into a substrate of the...http://www.google.fr/patents/US6753199?utm_source=gb-gplus-shareBrevet US6753199 - Topside active optical device apparatus and method
Topside active optical device apparatus and method
