A microelectronic package is disclosed including a microelectronic device, a substrate, and a signaling path coupling the microelectronic device with the substrate. The signaling path includes a conductive material, a solder joint, and a barrier material disposed between the conductive material and the...http://www.google.fr/patents/US7122460?utm_source=gb-gplus-shareBrevet US7122460 - Electromigration barrier layers for solder joints
