A printed circuit board is formed with a heat transfer region and at least one via in thermal communication with the region that transfers heat to the at least one region. A chassis is placed in thermal contact with the region so as to receive and dissipate heat from the region. A heat generating component...http://www.google.fr/patents/US6639801?utm_source=gb-gplus-shareBrevet US6639801 - Mechanical packaging architecture for heat dissipation
Mechanical packaging architecture for heat dissipation
