A bump electrode includes a core portion provided on an intermediate electrode layer formed on an electrode pad formed on a surface of an element. The core portion contains a material having a Young's modulus less than that of soldering. An electrically conductive film covers the core portion....http://www.google.fr/patents/US5666270?utm_source=gb-gplus-shareBrevet US5666270 - Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode
Bump electrode, semiconductor integrated circuit device using the same ...
