An apparatus and method for surface-mounting ball grid array integrated circuit (IC) devices to printed circuit boards. A thin single- or multi-layer sheet of nonconductive material having a plurality of apertures corresponding to the leads of the IC device to be mounted is interposed...http://www.google.fr/patents/US5796590?utm_source=gb-gplus-shareBrevet US5796590 - Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
Assembly aid for mounting packaged integrated circuit devices to printed ...
