A heat dissipation structure of an IC includes a circuit board provided with through holes perforated thereinto, an IC mounted on the upper surface of the circuit board, a solder filling a space between the circuit board and the IC via the through holes and being cured, and solder lands formed on the...http://www.google.fr/patents/US6728106?utm_source=gb-gplus-shareBrevet US6728106 - Heat dissipation structure of integrated circuit (IC)
Heat dissipation structure of integrated circuit (IC)
