A semiconductor chip packaging assembly comprising a frame having a central aperture, a flexible substrate attached to the frame across the central aperture, and a unitary support structure having a plurality of apertures therethrough attached to the substrate within the central aperture of the frame...http://www.google.fr/patents/US6359335?utm_source=gb-gplus-shareBrevet US6359335 - Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
Method of manufacturing a plurality of semiconductor packages and the ...
