A method of forming an electrically conductive via. A first electrically conductive layer is formed, and a second layer is formed on the first layer. The second layer has desired barrier layer properties. A third non electrically conductive layer is formed on the second layer. A via hole is etched through...http://www.google.fr/patents/US6949457?utm_source=gb-gplus-shareBrevet US6949457 - Barrier enhancement
