To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In one embodiment, a ceramic portion of the substrate includes at least one capacitor formed...http://www.google.fr/patents/US7535728?utm_source=gb-gplus-shareBrevet US7535728 - Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors
Electronic assemblies comprising ceramic/organic hybrid substrate with ...
