An integrated circuit package having large conductive area and method for fabricating the same is provided. The package includes an integrated circuit chip having upper and lower surfaces and a photosensitive device formed on the upper surface. A bonding pad is subsequently formed on the upper surface...http://www.google.fr/patents/US20080191343?utm_source=gb-gplus-shareBrevet US20080191343 - Integrated circuit package having large conductive area and method for fabricating the same
Integrated circuit package having large conductive area and method for ...
