Microelectronic devices and methods of packaging microelectronic devices are disclosed herein. In one embodiment, a method includes placing a plurality of singulated radiation responsive dies on a support member, electrically connecting circuitry of the radiation responsive dies to contacts of the support...http://www.google.fr/patents/US7321455?utm_source=gb-gplus-shareBrevet US7321455 - Microelectronic devices and methods for packaging microelectronic devices
Microelectronic devices and methods for packaging microelectronic devices
