In order to obtain a semiconductor device of which bonding reliability between a semiconductor element 7 and a printed wiring board 1 is improved and a manufacturing method thereof, in a semiconductor device mounted a semiconductor element 7 on a printed wiring board 1, while a circumference of a metal...http://www.google.fr/patents/US6388321?utm_source=gb-gplus-shareBrevet US6388321 - Anisotropic conductive film and resin filling gap between a flip-chip and circuit board
Anisotropic conductive film and resin filling gap between a flip-chip and ...
