A device for making temporary or permanent electrical connections to circuit pads of an integrated circuit is made with conventional semiconductor fabrication processes. The device has a supporting substrate from which project a plurality of insertion structures that are in mating alignment with corresponding...http://www.google.fr/patents/US5323035?utm_source=gb-gplus-shareBrevet US5323035 - Interconnection structure for integrated circuits and method for making same
Interconnection structure for integrated circuits and method for making same
