A probing system for electrical testing of a semiconductor device uses a probe device including probe tips on a surface of a semiconductor die. The probe tips can be fabricated as metal bumps on contact pads having a pattern that is the same as the pattern of contact pads on the semiconductor device....http://www.google.fr/patents/US7405581?utm_source=gb-gplus-shareBrevet US7405581 - Probing system uses a probe device including probe tips on a surface of a semiconductor die
Probing system uses a probe device including probe tips on a surface of a ...
