In one embodiment of the invention, a semiconductor component includes: a leadframe (110, 210, 310, 410) having a surface (111, 211, 311, 411); an integrated passive component (120, 220, 320, 420) located above the surface of the leadframe; a semiconductor chip (130, 230, 330, 430) electrically coupled...http://www.google.fr/patents/US7074647?utm_source=gb-gplus-shareBrevet US7074647 - Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other
Semiconductor component comprising leadframe, semiconductor chip and ...
