Disclosed is a method of making a mold lock for bonding leadframe-to-plastic in an IC package. Steps include providing niches from opposing sides of the leadframe. The opposing niches are arranged such that an aperture and a mechanical key are formed within the leadframe material by the partial intersection...http://www.google.fr/patents/US6794738?utm_source=gb-gplus-shareBrevet US6794738 - Leadframe-to-plastic lock for IC package
