An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises...http://www.google.fr/patents/US5751553?utm_source=gb-gplus-shareBrevet US5751553 - Thin multichip module including a connector frame socket having first and second apertures
Thin multichip module including a connector frame socket having first and ...
