A converging design multi-chip module having semiconductor chips connected to a substrate recessed into a cavity of the MCM package body, the chips being interconnected using flip chip and control collapse chip connection, wherein a metal heatspreader plate is adapted to engage the backside of the chips...http://www.google.fr/patents/US5289337?utm_source=gb-gplus-shareBrevet US5289337 - Heatspreader for cavity down multi-chip module with flip chip
Heatspreader for cavity down multi-chip module with flip chip
