This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cuboid structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically...http://www.google.fr/patents/US5343366?utm_source=gb-gplus-shareBrevet US5343366 - Packages for stacked integrated circuit chip cubes
Packages for stacked integrated circuit chip cubes
